Location: TSV Workshop , Weds 3rd Oct 2012, Didcot, UK
Attendees: All welcome
This joint NanoKTN & JEMI Workshop will focus on TSV's and the associated technology - lithography, etch, seed layers, deposition and plating/fill techniques.
Advanced packaging is at the heart of More Than Moore which is seen as a key driver
of our industry over the next decade. The need to integrate mixed mode devices into
smaller form factor packages and manage performance and thermal effects as well as
enhancing reliability are driving the technology towards the use of TSV's and
interposers as a means to achieve these multiple requirements.
Despite credible forecasts of up to around 10% of device production incorporating
these features by 2017, and multiple announcements by both large and smaller device
manufacturers alike, there is not a complete supply chain and it remains very difficult
to go out to buy everything that is needed to fabricate such devices.
This is a unique challenge to the equipment and materials sector as the solutions do
not always relay on either or all of the usual requirements such as large wafers, very
fine linewidths and exotic materials, but are often achieveable using last generation
equipment sets and readily adapted materials. This gives new impetus to some of the
smaller suppliers and those who are not involved at the conventional leading edge to
gain leadership positions by developing their products and services alongside these
opportunities in a market forecast to reach a total of $40bn by 2017 in device value
terms.
This workshop will explore the fabrication process through a series of talks on
various parts already developing, and examine opportunities with a focus on the
needs of device manufacturers who will be speaking and present on the day. The
outcomes will include actions to follow up both individually for the delegates and also
for future workshops as we watch this trend actively at JEMI and the Nanotechnology
KTN.
PROGRAMME
09.00 Registration, Refreshments & Table Top Set Up
10.00 Introduction & Welcome Ian Burnett, Director, JEMI UK Ltd. Download presentation here >>
10.20 The shrinking world of medical implants Piers Tremlett, Microsemi Download presentation here >>
10.50 TSVs in full thickness wafers Andrew Bunting, University of Edinburgh Download presentation here >>
11.20 Coffee & Exhibition 11.50 TSV Metallisation John Macneil, Picofluidics Download presentation here >>
12.20 Metrology Challenges in TSV Fabrication Mark Berry, Metryx Download presentation here >>
12.50 Lunch & Exhibition
14.10 Micro and Nanofabrication of Silicon Devices Brendan Casey, Kelvin Nanotechnology Download presentation here >>
14.40 Open Discussion How to fabricate TSV’s on a small scale and are there gaps and opportunities in the UK supply chain? Download presentation here >>
15.45 Summary
16.00 Meeting Close
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