|
|
|
|
Acronym List (around 1200) |
Home |
|
|
|
|
|
Acronym List (around 1200) |
Home |
|
|
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
The following list of over one thousand acronyms has been compiled to assist those involved in any field associated with the semiconductor production industry. New acronyms appear daily, so it is quite impossible for such a list to be anywhere near complete. A further complication arises because many acronyms have more than one meaning, as can be seen from various examples in the list below. A few general acronyms have been included in the list, partly for the benefit of those whose native language is not English. For convenience, some abbreviations that are not true acronyms have been inserted. Fortunately the English Language is nearly universally used in the semiconductor industry, so if you come across an unfamiliar acronym related to this industry, visit this web site where there is an excellent chance you will find its meaning. It is planned to expand this acronym list so that it will continue to be as useful as possible. If you find any important acronym that has been omitted, please do let us know at JEMI so that we can insert it for the benefit of all users. (c) Brian Dance, 1999 A. Å Angstrom unit (0.1 nm or 10-10 m, comparable with size of an atom)a-Si:H Hydrogenated Amorphous Silicon AAS Atomic Absorption Spectroscopy ACA Anisotropic Conducting Adhesive ACCUFET Accumulation Channel MOSFET ACE Advanced CMOS for Europe ACE Automated Clean Environment ACGIH American Conference On Governmental Industrial Hygienists, Inc. ACOST Advisory Council on Science and Technology (UK) ACRT Accelerated Crucible Rotation Technique ADC Analogue-to-Digital Converter ADEQUAT Advanced Development For CMOS Technologies (JESSI Project) ADF Automatic Defect Classification ADP Atmospheric Downstream Plasma ADS ASIC Design System AEA American Electronics Association AEB Accuflow Etch-Back AERIAL Automated Enhanced Resolution For Advanced Lithography AES Auger Electron Spectroscopy AFCS Auto Flow Chemical Sampler AFM Atomic Force Microscopy AGM Aggressive Gas Monitor AGV Automatic Guided Vehicle ALE Atomic Layer Epitaxy ALRI Advanced Lithography Research Initiative (UK) AMC Airborne Molecular Contamination AMEL Active Matrix Electroluminescence AMLCD Active Matrix Liquid Crystal Display AMST American Society for Testing Materials ANOVA Analysis of Variance AOM Acousto-Optic Modulator AOX Absorbable Organic Halogen A&P Assembly and Packaging APC Advanced Process Control APCVD Atmospheric Pressure Chemical Vapour Deposition API Application Programming Interfaces APIMS Atmospheric Pressure Ionisation Mass Spectroscopy APS Active Pixel Sensor APTPA Automatic Probe-To-Pad Alignment AR Aspect Ratio ARC Anti-Reflective Coating ARDE Aspect Ratio Dependent Etch(ing) ArF Argon Fluoride (excimer far UV laser emitting at 193 nm wavelength) ARMS Automatic Reticle Management System ARPA Advanced Research Projects Agency (US) ARS Advanced Resist Systems ARXPS Angle Resolved X-Ray Photoelectron Spectroscopy ASAP As Soon As Possible AS/RS Automatic Storage/Retrieval System ASE Advanced Silicon Etching ASIC Application Specific Integrated Circuit ASM Advanced Semiconductor Materials ASOC Active Silicon Integrated Optical Circuit ASP Average Selling Price ASPA Advanced Semiconductor Packaging Assembly ASSP Application Specific Standard Product ASTEC Assembly and Test Consortium ASTI Advanced Semiconductor Technologies Inc. (Japan) ASTM American Society For Testing Materials ATAB Area Array Tape Automated Bonding ATE Automatic Test Equipment ATP Advanced Technology Program ATPG Automation Test Pattern Generator AU Address Unit AUTOWEC Automated Wafer Environmental Control AVEM Association of Vacuum Equipment Manufacturers (US) AVI
Automatic
Visual Inspection B. BACUS SPIE Technical Group For Advancing Photomask Technology (Obsolete) BARC Bottom Anti-Reflective Coating BARC Bottom Anti-Reflective Coating BCB Benzocylcobutene (dielectric) BCM Buried Coarctate Mesa BAS-R Basic Research BBEM Behaviour-Based Equipment Model BCD Bulk Chemical Distribution BED Boron Enhanced Diffusion BEOL Back End Of The Line BEP Beam Equivalent Pressure BESSY Berliner Elektronenspeicherring-Gesellschaft Für Synchrostrahlung mbH (Berlin electron storage ring group for synchrotron radiation) BGA Ball Grid Array BHP Blower Horse Power BILLI Buried Implanted Layer for Lateral Isolation BIM Binary Mask BIST Built-In Self-Test BKD Backscatter Kikuchi Diffraction BLMS Borderless Master Slice BLOK Barrier of Low k (Low dielectric constant) BMBF (German for Federal Ministry of Education) BOE Buffered Oxide Edge BOX Barrier Oxide BOX Buried Oxide BPC Back Photo-Current BPSG Boron Phosphorus Spin-On-Glass BPTEOS Boron Phosphorus Spin-on-Glass Deposited With TEOS Precursor BRITE Basic Research in Industrial Technologies in Europe BSG Borosilicate Glass BSI British Standards Institution BSM Black Silicon Method BST Barium Strontium Titanate BTAB Bumped Tape Automated Bonding C. C4 Ceramic Collapse Chip Connect C-HEMT Conventional High Electron Mobility Transistor CABGA Chip Array Ball Grid Array CAC Catalytically Active Chemi-sorbent CAD Computer Aided Design CAE Computer Aided Engineering CAGR Compound Annual Growth Rate CAIBE Chemically Assisted Ion Beam Etching CAM Computer Aided Manufacture CAPM Computer Aided Production Management CASE Co-operative Awards in Science and Engineering (UK) CAVE Computer Aided Design for VLSI in Europe CBGA Ceramic Ball Grid Array CC Contamination Control CC Chlorocarbon CC Competence Centres CCD Charge Coupled Device CCH Controlled, Consistent High Performance CCM Close Confinement CCPIC CMOS Compatible Power Integrated Circuit CCS Constant Current Stress CCZ Continuous Czochralski CD Critical Dimension CDA Clean Dry Air CDI Collector Diffusion Isolation CDM Chemical Delivery Module CDM Charged Device Model CDMS Chlorodimethylsilane CDS Controlled Diversions Sputtering CDSEM Critical Dimension Scanning Electron Microscopy CE Chemical Etching CEL Contrast Enhancement Layer CEL Contrast Enhancement Lithography CERDIP Ceramic Dual-in-Line Package CERQUAD Ceramic Quad Flatpack CEST Centre for the Exploitation of Science and Technology CFC Chlorofluorocarbon CFD Computational Fluid Dynamics CFM Contamination Free Manufacturing CFM Continuous Flow Measurement CHARM Charge Monitor Wafer CHDS Chip Hierarchical Design System CHISEL Channel Initiated Secondary Electron injection CIM Computer Integrated Manufacturing CIMID Chip in Moulded Interconnection Device CLCC Ceramic Leadless Chip Carrier CLSM Confocal Laser Scanning Microscope CLTC Closed Loop Temperature Control CMF Central Microstructure Facility at RAL (see RAL) CMISE Common Management Of Information Service Elements CMOS Complementary Metal Oxide Silicon CMP Chemical Mechanical Planarisation CMP Chemical Mechanical Polishing CMS Chlorinated Methylated Styrene CMT Cadmium Mercury Telluride COB Chip On Board COG Chip-On-Glass COG Chrome-On-Glass Mask COO Cost Of Ownership COS Corona Oxide Semiconductor Testing CPE Customer Premises Equipment CPGA Ceramic Pin-Grid Array CPLD Complex Programmable Logic Device CRADA Co-operative Research and Development Agreement CS Control System CSE Critical Shape Error CSP Chip-Scale Package CTE Coefficient of Thermal Expansion CTMC Cluster Tool Module Communications CTMS Chlorotrimethylsilane CuPMC Copper Process Control Module CV Capacitance-Voltage Measurements CVD Chemical Vapour Deposition CVS Constant Voltage Stress CYH Cyclohexanone CYP Cyclopentanone CZ Czochralski D. DA Dopant Activation DA Dopant Annealing DAC. Digital-to-Analogue Converter DADBS Diacetyloxy-ditertiarybutoxysilane DARPA Defense Advanced Research Projects Agency (US) DBS Data Base Server DBS Direct Broadcast From Satellite DBS Double Beam Ellipsometry DC Direct Current DC Dark Current DC Dark Channel DCA Direct Chip Attachment DCFL Direct Coupled FET Logic DCGS Drain Contact to Gate Spectroscopy DCPBH Double Channel Planar Buried Heterostructure DCS Dichlorosilane DCXRC Double Crystal X-Ray Rocking Curve DDE Dynamic Data Exchange DDP Directional Downstream Plasma DECT Digital Enhanced Cordless Phones DES Data Encryption Standard DETR Department of Transport, Environment and the Regions (UK government) DFED Diamond Diode Field Emission Display DFM Design For Manufacturability DFT Design For Testability DFT Density Functional Theory DHF Dilute Hydrofluoric Acid DI Device Isolation DI Dielectric Isolation DIBL Drain Induced Barrier Lowering DIW Deionised water DL Diffusion Limited DLC Diamond-Like Carbon DLC Defect Localisation and Characterisation DLM Double Level Metal DLTS Deep Level Transient Spectroscopy DMAH Dimethyl Aluminium Hydride DMD Digital Micromirror Device DMFC Digital Mass flow Controller DMLS Dielectrics in Multi-Layered Structures DMSDMA Dimethylsilyl-dimethylamine (A resist silyation agent) DMT Discrete Multi-Tone DNC Dynamic Reaction Cell DOE Design of Experiment DOE Department of the Environment (UK) DOF Depth Of Field DOF Depth of Focus DOP Dioctylphthalate DPC Differential Photo-Current DPF Dense Plasma Focus DPS Decoupled Plasma Source DPS Direct Probe Sensor DQ Design Qualification DRA Defence Research Agency (UK) DRAM Dynamic Random Access Memory DRIE Deep Reactive Ion Etching DRM Dissolution Rate Monitor DRS Diffuse Reflectance Spectroscopy DRT Defect Review Tool DSMC Direct Simulation Monte Carlo DSM Deep Sub-Micron DSM Defect Sensitivity Mask DSP Double Side Polarised DSP Digital Signal Processor DSW Direct Step On Wafer DTI Department of Trade and Industry (UK) DTM Demonstration Test Method DU Data Unit DUMIC Dielectric for ULSI Multilevel Interconnect DUT Device Under Test DUV Deep Ultra-Violet DWB Direct Wafer Bonding E. E-Beam Electron Beam EARN European Academic and Research Network EBDW Electron Beam Direct Write EBIC Electron Beam Induced Current EBL Electron Beam Lithography EBLF Electron Beam Lithography Facility EBMM Electron Beam Mask Making EBRTA Electron Beam Rapid Thermal Annealing EBSD Electron Backscatter Diffraction EBSM Environmental Benign Semiconductor Manufacturing Engineering Research Centre (Tucson, Arizona) EC European Commission EC European Community ECD Electrical Critical Dimension ECL Emitter Coupled Logic ECMA European Computer Manufacturers' Association ECOST European Co-operation on Science and Technology ECR Electron Cyclotron Resonance ECTFE Copolymer of Ethylene and Chlorotrifluoroethylene ECV Electrically Controlled Valve EDC Engineering Data Collection EDI Electro-De-Ionisation EDI Electronic Data Interchange EDS Energy Dispersive Spectroscopy EDX Energy Dispersive X-Ray Analysis EDXRF Energy Dispersive X-ray Fluorescence EEA Electronic Engineering Association EEC European Economic Community EECA European Electronic Components Manufacturers' Association EEIR Electronics Industrial Environmental Roadmap EELS Electron Energy Loss Spectroscopy EEP Ethyl-3-Ethoxypropionate EEPROM Electrically Programmable Read-Only Memory EFI Electrical Fault Isolation EFTEM Energy-Filtering Transmission Electron Microscope EGEE 2-Ethoxyethanol EGEEA 2-Ethoxyethanol Acetate EHS Environmental Health and Safety EIJA Electronic Industries Association of Japan EL Electroluminescence EL Exposure Latitude ELNES Energy-Loss Near Edge Structures ELYMAT Electrolytic Metal Analysis Tool EM Electro-Migration EMAS Eco-Management And Audit Scheme (European Union) EMC Electronics Materials Committee EMEC Electrical and Mechanical Engineering Committee EOS Electrostatic Overstress EP End Point EPA Environmental Protection Agency (US) EPD Etch Pit Density EPTFE Expanded Poly-TetraFluoroEthylene EQFP Enhanced Plastic Quad Flatpack ER Enhanced Ramp ERC Engineering Research Commission ERF Edge Response Function ERW Edge Response Width ESA European Space Agency ESAT Electronics, Systems, Automation and Technology ESC Equipment Support Company (UK) ESC Electrostatic Chuck ESCA Electron Spectroscopy For Chemical Analysis ESCAPE Environmental Safety Cleaning and Protection Equipment (DAS, Dresden) ESD Electro-Static Discharge ESF European Science Foundation ESI Electron Spectroscopic Images ESPRC Engineering and Physical Sciences Research Council ESPRIT European Strategic Programme For Research In Information Technology ESO Electrical Stress on Oxide ESR Electron Spin Resonance EST Equipment Selection Team ET Electrical Test ETL Ethyl Lactate EU European Union EUCLIDES Extreme UV Concept Lithography Development System EURACCESS European Advance Centres for Co-ordinating and Enabling Support in Long Term Silicon Research EURAM European Research in Advanced Materials EUREKA European Research And Co-ordination Agency EuroFE European Applications of Field Emission Programme EUV Extreme Ultra-Violet EUVL Extreme Ultra Violet Lithography EXELFS Extended Energy-Loss Fine Structures FA Furnace Annealing FA Failure Analysis FANETA Failure Analysis plasma Etch Equipment Assessment FAST Forecasting and Assessment in Science and Technology FAW Flexible Automated Wafer Production FCIP Flip Chip In Package FCOB Flip Chip On Board FCS Flow Control System FDC Fault Detection and Classification FEA Field Emitter Array FEA Fine Element Analysis FEA Finite Element Analysis FED Field Emission Display FEDLIT Field Emission Backlight (for display) FEI Federation of the Electronic Industries FEM Finite Element Method FEOL. Front End Of the Line FeRAM Ferroelectric Random Access Memory FESEM Field Emission Scanning Electron Microscopy FFU Filter Fan Unit FIB Focused Ion Beam FIBL Focused Ion Beam Lithography FIFO First In First Out FLAT Full Linear Air Tilt Stage FLC Ferroelectric Liquid Crystal FLCD Ferroelectric Liquid Crystal Display FMCS Facility Management Control System FMECA Future Mode Effects and Cause Analysis FMS Factory Management System FMV Foreign Market Value FOSP Front Opening Shipping Box FOUP Front Opening Universal Pod FOV Field Of View FPC Front Photo-Current FPD Flat Panel Display FPGA Field Programmable Gate Array FPI Fab Productivity Index FQFP Fine Pitch Quad Flatpack FSA Fabless Semiconductor Association (US) FSBE Front-Side Bulk Etching FOG Fluorinated Oxide Glass FSG Fluorinated Silica Glass FSRAM Fast Static Random Access Memory FTIR Fourier Transform Infra-Red Spectroscopy FVA Face Velocity Analyser FWHM Full Width At Half Maximum Height FZ Floating Zone G. GDMS. Glow Discharge Mass Spectrometry GDS Gas Distribution System GDS Glow Discharge optical emission Spectrometer GDDS Gas Dome Dielectric System GEM Generic Equipment Model GFAA Graphite Furnace Atomic Absorption GIDL Gain Induced Drain Leakage GILD Gas Immersion Laser Doping GIXR Grazing Incidence X-Ray Reflectivity GMRH Giant Magneto-Resistive Head GOF Goodness Of Fit GOI Gate Oxide Integrity GPS Global Positioning System GQFP Guard Ring Quad Flatpack GRC Gas Reactor Column GRESSI Grenoble Submicron Silicon (France) GSI Giga-Scale Integration GSMBE Gas Source Molecular Beam Epitaxy GTC Golden Template Comparison GTM Gray Tone Masks GUI Graphical User Interface GWP Global Warming Potential H. HAR High Aspect Ratio HASL. Hot Air Solder Levelled HAST Highly Accelerated Biased Stress Test HB Horizontal Bridgman HBM Human Body Model (for ESD) HBT Heterojunction Bipolar Transistor HBT Heterojunction Bipolar Technology HCM Hollow Cathode Magnetron HDC Hard Die Coat HDI High Density Implantation HDIS High Dose Implant Strip HDP-CVD High Density Plasma Chemical Vapour Deposition HEMT High Electron Mobility Transistor HEPA High Efficiency Particulate Air Filter HIBS Heavy ion Backscattering Spectrometry HiPerMOS High Performance Logic Process HMDS Hexamethyldisilane HMDS Hexamethyldisilazane HOSP Hybrid Organic Siloxane Polymer (low k dielectric) HPCVD High Pressure Chemical Vapour Deposition HPLEC High Pressure Liquid Encapsulated Czochralski HPM Hazardous Production Material HPVS High Pressure Vacuum Sintered HRTEM High Resolution Transmission Electron Microscopy HRXRD High Resolution X-Ray Diffraction HSFG Hemispherical Grain Polysilicon HSMS High Speed Message Standard HTCC High Temperature Co-fired Ceramic HTS High Temperature Storage HVAC High Vacuum I. IAPOL Industrial Affiliation Programme on Optical Lithography (IMEC) IBE Ion Beam Etching IBL Ion Beam Lithography IBM Ion Beam Etching ICB-CVD Ion Cluster Beam Chemical Vapour Deposition ICM Inter-Connect Metallisation ICP-MS Inductively Coupled Mass Spectrometry ICP Inductively Coupled Plasma ICPAES Inductively Coupled Plasma Atomic Emission Spectroscopy ICP-MS Inductively Coupled Mass Spectrometry IDA Implanted Dopant Annealing IDD Implant Dopant Diffusion IDE Integrated Development Environment IDM Integrated Device Manufacturing IEA Ion Energy Analyser IEATP Information Engineering Advanced Technology Programme IED Ion Energy Distribution IEDM International Electron Devices Meeting IEE Institution of Electrical Engineers (UK) IEEE Institute of Electrical and Electronic Engineers (Washington D.C.) IGBT Insulated Gate Bipolar Transistor IH Industrial Hygiene IID Ion Implantation Damage IIDA Ion Implanted Dopant Annealing ILB Inner Lead Bonding ILD Insulating Layer Dielectric ILD Inter-Layer Dielectric IMA Integrated Measurement Association IMD Inter-Metallic Dielectric IMEC Inter-university Micro-Electronics Centre (Leuven, Belgium) IMP Ionised Metal Plasma IMPS Interconnected Mesh Power System IMS Ion Mass Spectroscopy INC/FCCC Inter-governmental Negotiating Committee for Framework Convention Climate Change INCAM Individual Cassette Manufacturing I/Os Input/Outputs IOL Intermittent Operating Life IQ Installation Qualification IPA Isopropyl alcohol IPCC Intergovernmental Panel on Climate Change IPD Integrated Passive Device IPL Ion Projection Lithography IPM Ionised Metal Plasma IPR Intellectual Property Rights IS Information Systems ISDZR In-Situ Distillation Zone Refining ISI Information Sciences Institute (California) ISI Intrinsic Safety Index ISL Innovation in Industrial Lithography ISO International Standards Organisation ISPM In-Situ Particle Monitoring ISRA In-Situ Removal Monitor IST Information Societies Technology Programme ISTS Impulsive Stimulated Thermal Scattering IT Information Technology ITO Indium Tin Oxide IVPS Integrated Vacuum Processing System J. JDP Joint Development Project JEMI Joint Equipment Manufacturers' Initiative (JEMI-UK and JEMI-France) JESSI Joint European Submicron Silicon Initiative JI Junction Isolation JOERS Joint Optoelectronics Research Scheme (Now completed) K. KGD Known Good Die KrF Krypton Fluoride (Excimer uv laser emitting 248 nm wavelength) KSIA Korean Semiconductor Industry Association L. LASER Light Amplification by the Stimulated Emission of Radiation LBF Langmuir-Blodgett Film LC Light Channel LCD Liquid Crystal Display LCOS Liquid Crystal On Silicon LCVD Laser-Induced Chemical Vapour Deposition LDA Local Density Approximation LDCC Leaded Ceramic Chip Carrier LDD Lightly Doped Drain LDDMOS Lateral Double Diffused MOS LDMOS Lateral Diffusion MOSFET LDSD Low Dimensional Structures and Devices LEC Liquid Encapsulated Czochralski LEEM Low Energy Electron Microscope LEL Lower Explosive Limit LEP Light Emitting Polymer LETI Laboratoire d'Electronique de Technologie et d'Instrumentation (Grenoble, France) LGA Land Grid Array LIF Laser Induced Fluorescence LIGA Lithographie Galvanoformung Abformung LIGBT Lateral Isolated Gate Bipolar Transistors LNA Low Noise Amplifier LOCOS Local Oxidation Of Silicon LOCSS Logistical Centre for Sorting and Stocking LPCVD Low Pressure Chemical Vapour Deposition LPE Liquid Phase Epitaxy LPHD-PE Low Pressure High Density Plasma Etch(ing) LPRAS Low Pressure Reactor Analysis System LPT Linear Planarisation Technology LPTEOS Low Pressure Tetra-ethoxysilane LPXS Laser Plasma X-ray Source LQA Limited Quantity Exemption (US) LS Lens Scan LSMS Laser Scan Mass Spectroscopy LTCC Low Temperature Co-fired Ceramic LTO Low Temperature Oxide LTPCVD Low Temperature Photo-Chemical Vapour Deposition LVSEM Low-Voltage Scanning Electron Microscopy M. MADI Macro After Develop Inspection MAK Maximum Workplace Concentration (Maximale Arbeitsplatz Konzentration) MBE Molecular Beam Epitaxy MBGA Metal Ball Grid Array MBO Management Buyout MBT Metal Base Transistor MBW Multi-Blade Wafering MCBF Mean Cycles Between Failures MCD Magnetic Circular Dichroism MCM Multi-Chip Module MCR Moulded Carrier Ring MCS Material Control System MCS Monte Carlo Simulation MCXD Magnetic Circular X-Ray Dichroism (m Micrometre (10-6 metre, 1000 nm or 10-3 mm) MDL Minimum detection Level MEDEA Microelectronic Development For European Applications (successor to JESSI) MEE Migration Enhanced Epitaxy MEF Mask CD deviation Enhancement Factor MEMS Micro Electro-Mechanical Systems MERIE Magnetically Enhanced Reactive Ion Etching MES Manufacturing Execution Systems MESC Modular Equipment Standards Committee MESFET Metal-Semiconductor FET MFC Mass Flow Controller MFS Minimum Feature Size MIDAS Multi-Chip Module Interconnect Designers' Access Service MIS Metal-Insulator Semiconductor ML. Monolayer MLTF Multi-Layer Thin Film MLRV Mechanical Robot Loading Vehicle MM Machine Model MMI Man-Machine Interface MMIC Monolithic Microwave Integrated Circuit MMST Microelectronics Manufacturing Science and Technology MMTCE Million Metric Tons of Carbon Equivalents MO Metal-Organic MOCVD Metal Organic Chemical Vapour Deposition MOD Modulation Doped MoD Ministry of Defence (UK) MODFET Modulation Doped Field Effect Transistor MOEMS. Micro-Optical Electro-Mechanical System MOMBE. Metal Organic Molecular Beam Epitaxy MOMS Micro-Optical Mechanical System MORIE Metal Organic Reactive Ion Etch(ing) MOS Metal Oxide Semiconductor MOS Multi-Observation Study MOSIS Micro-Optical SIlicon Systems MOVPE Metal Organic Vapour Phase Epitaxy MPA Monolithic Power Amplifier MPC Multi-Project Chip MPEG Motion Picture Experts Group (Decoders) MPPS Most Penetrating Particle Size MPW Multi-Project Wafer MQFP Metric Quad Flatpack MQUAD Metal Quad Flatpack MR Metallisation Reliability MRH Magneto-Resistive Head MS Mass Spectrometry MSI Medium Scale Integration MTBF Mean Time Between Failures MTF Modulation Transfer Function MTL Mass Transport Limited MTTA Mean Time To Assist MTTF Mean Time To Failure MTTR Mean Time To Repair MWA Multiple Wafer Annealing N. NA Numerical Aperture NAA Neutron Activation Analysis NACS National Advisory Committee On Semiconductors NAFPD North American Flat Panel Display (Part of SEMI) NANU Net Added Non-Uniformity NBG Near Bandgap NBGPL Near Bandgap Photoluminescence NEG Non-Evaporable Getter NEL National Engineering Laboratory (UK) NEMI National Electronics Manufacturing Institute NERC National Environment Research Council (UK) NERI National Electronics Research Initiative (UK) NETD Noise Equivalent Temperature Difference NEXAFS Near-Edge X-Ray Absorption Fine Structure NGL Next Generation Lithographies NIST National Institute Of Standards (US) NL Nano-Lithography Nm Nanometre (10-9 metre, one thousandth of a micron) NM Nitrided Mode NMI National Microelectronics Institute (UK) NPL National Physical Laboratory (UK) NPL Normal Process Concentration Level NRE Non-Recurring Engineering Charges NSG Non-Doped Silicate Glass NSMP National Semiconductor Metrology Programme NSOM Near-Field Scanning Optical Microscopy NTD Neutron Transmutation Doping NTRS National Technology Roadmap for Semiconductors (US) O. OB Oxide Breakdown OCAP Out-of-Control Action Plan OCR Optical Character Recognition OD Oxide Damage ODCR Optically Detected Cyclotron Resonance ODP Ozone Depleting Product OEE Overall Equipment Efficiency OEIC Optoelectronic Integrated Circuit OEM Original Equipment Manufacturer OFA Oil Free Air OFR Overflow Rinse OL Optical Lithography OLED Organic Light Emitting Diode OMG Object management Group OOM Object Orientated Methodologies OP Oxide Processing OPC Optical Proximity Control OPC Optical Proximity Correction OPE Optical Proximity Effect OQ Oxide Quality OQ Operational Qualification ORC Optoelectronics Research Centre OSDA Optical Shallow Defect Analyser OSF Oxygen-Induced Stacking Fault OSG Organo-Silicate Glass OSHA Occupational Safety and Health Administration OSI Open Systems Interconnects OSLT Open-Short-Load-Through OSP Optoelectronic Systems Programme (UK) OST Office of Science and Technology (UK) OTS Octadecyltrichlorsilane OTV Odour Threshold Value OLD Outer Lead Bonding OZP Ozone Depleting P. PAB Post Apply Bake PAE Power Added Efficiency PBLOCOS Poly-Buffered Local Oxidation Of Silicon PBS Polybutene-1 Sulphone PC Program Counter PCB Printed Circuit Board PCD Photoconductive Decay PCMCIA Personal Computer Memory Card International Association PCS Production Cost savings PCS Personal Communications Systems PCT Post Clean Treatment PCVD Plasma Chemical Vapour Deposition PCYM Probe Card Yield Manager PD Plasma Doping PDIP Plastic Dual-In-Line Package PDLC Polymer Dispersed Liquid Crystal Display PDM Plasma Damage Monitoring PDP Plasma Display Panel PDPP Plasma Deposited Photosensitive Polymer PDS Polydimethylsiloxane PDVF Polyvinyldifluoride PE Plasma Etch(ing) PEB Post Exposure Bake PEB Partial Etch-Back PECVD Plasma Enhanced Chemical Vapour Deposition PEELS Parallel Electron Energy Loss Spectroscopy PEEM Photo-Electron Emission Microscope PEL Permissible Exposure Limit PEM Plasma Equipment Models PEM Proton Exchange Membrane PEP Performance Enhancement Platform PEP Plasma Etch Processing PERIE Plasma Enhanced Reactive Ion Etch PETEOS Plasma Enhanced Chemical Vapour Deposition with TEOS Precursor PFA Polyfluoroalkoxy PFC Perfluoro-compound PFR Plug Form Reactor PGA Pin-Grid Array PGMEA Propylene Glycol Monomethyl Ether Acetate PGRM Programme PHEMT Pseudomorphic HEMT PI Pyroelectric Interferometry PIC Photonic Integrated Circuit PID Process Induced Defect PIII Plasma Immersion Ion Implantation PL Photoluminescence PLAD Plasma Aided Doping PLASMAX Plasma Mechanical Activation and Extraction of Particulate Contamination PLCC Plastic Leadless Chip Carrier PLCC Plastic Leaded Chip Carrier PLD Programmable Logic Device PLEDM Phase-state Low Electron Number Drive Memory PLIF Planar Laser-Induced Fluorescence PLL Phase Locked loop PLM Pad Limiting Metals PLS Photoluminescence Surface State Spectroscopy PM-HEMT Pseudomorphic HEMT PM Preventative Maintenance PMA Post Metal Anneal PMC Post Mould Control PM&C Pressure Measurement and Control PMI Phase Measurement Interferometry PMMA Polymethyl Methacrylate ("Perspex", etc) PMT Photomultiplier Tube PNU Plasma Non-Uniformity PODIA Polymer Display Alliance POP Performance Optimised Polymer POU Point of Use PPGA Plastic Pin Grid Array PPS Production Planning System PQ Performance Qualification PQFP Plastic Quad Flat-Pack PR Photoresist PXRL Proximity X-Ray Lithography PSG Phospho-Silicate Glass PSI Process Sequence Integration PSIA Pounds Per Square Inch Absolute PSIG Pounds Per Square Inch gauge (PSIG = PSIA - 14.7) PSM Phase Shift Mask PSM Process Simulation and Modelling PST Process Sequence Integration PTB Physikalisch-Technische Bundesanstalt (Germany) PTFE Polytetrafluoroethylene PTM Photon tunnelling Microscope PVC Polyvinyl Chloride PVD Physical Vapour Deposition (Sputtering) PVD Plasma Vapour Deposition PVDF Polyvinylidene Difluoride PVS Photon Vision Systems PVW Process Validation Wafer PWB Printed Wiring Board PWP Particle Per Wafer Pairs PXS Plasma X-ray Source Q. QBD Charge to Breakdown QC Quad Cell QC Quality control QMA Quadrupole Mass Analyser QML Qualified Manufacturers' List QMS Quadrupole Mass Spectrometer QFP Quad Flatpack QUIF Quality Improvement Factor QWW Quantum Well Wires R. R&D Research and Development R&M Research and Maintenance RACE Research in Advanced Communications in Europe RAL Rutherford Appleton Laboratory (UK) RAM Random Access Memory RBS Rutherford Backscattering Spectrometry RDA Remote Data Access RDR Rotating Disc Reactor RDS Reflection Difference Spectroscopy REB Resist Etch-Back RESURF Reduced Surface Field RET Resolution Enhancement Technique RET Reticle Enhancement Technique RFI Radio Frequency Interference RF-ICP Radio frequency Inductively Coupled Plasma RFIDT Radio Frequency Identity Tags RFG Radio Frequency Generator RGA Residual Gas Analyser RGD-GC Reduction Detector Gas Chromatography RGD Reduction Gas Detector RHEED Reflection High Energy Electron Diffraction RIBE Reactive Ion Beam Etching RIE Reactive Ion Etch(ing) RISH Research Initiative into Silicon Hybrids RMSE Root Mean Square Error RO Reverse Osmosis ROC Radius of Curvature ROI Return on Investment ROIC Readout Integrated Circuit ROW Rest Of World RPECVD Remote Plasma Enhanced Chemical Vapour Deposition RPM Real Power Monitor RRL Reaction Rate Limited RS Reticle Stocker RS Radiation Sensitivity RSM Response Surface Methodology RSPI Reflection Supported Pyrometric Interferometry RTA Rapid Thermal Annealing RTCVD Rapid Thermal Chemical Vapour Deposition RTG Resistance To Ground RTN Rapid Thermal Nitridation RTP-CVD Rapid Thermal Processing Chemical Vapour Deposition RTO Raise Temperature of Oxidation RTP Rapid Thermal Processing RTV Room Temperature Vulcanising RWE Reactor Wall Effects RWG Ridge Wave Guide S. S(M Surface Micromachining SA-DMOS Self-Aligned DMOS SAC Self-Aligned Contacts SACVD Sub-Atmospheric Chemical Vapour Deposition SAED Selected Area Electron Diffraction SAG Self-Aligned Gate SALSA Small and Large Signal Analysis SAMPLE Simulation and Modelling Of Photo-Lithography And Etching SARI Silicon Architectures Research Initiative SAW Surface Acoustic Wave SBA Solder Ball Array SBA Semiconductor Business Association (UK) SBD Soft Breakdown SBFR Small Batch Enhanced Ramp SBIMOS Semiconductor Bipolar Metal Oxide Semiconductor SC - 1 Standard Clean - 1 (RCA clean) SCADA Supervisory Control And Data Acquisition SCAPEL Scattering with Angular Limitation Projection Electron Beam Lithography SCF Super-Critical Fluids SCG Semiconductor Components Group SCH Separate Confinement Heterostructure SCOR Supply Chain Operation Reference SCM Semiconductor Material SCM Scanning Capacitance Microscope SCM Scanning Electron Microscope SCSP Stacked Chip Scale Package SDB Silicon Direct Bonding SDI Silt Density Index SDMBIM Sensor-Driven Model-Based Integrated Manufacturing SDRAM Synchronous Dynamic Random Access Memory SDS Safe Delivery System SE Spectroscopic Ellipsometry SEA Semiconductor Equipment Association (European Union) SEAJ Semiconductor Equipment Association of Japan SEC Single Edge Contact SECS Semiconductor Equipment Communication Standards SEI Software Engineering Institute SELETE Semiconductor Leading Edge Technologies (Japanese Group) SEMI Semiconductor Equipment and Materials International SEMS SEMI Equipment and Materials Market Statistics Programme SEPM Scanning Electric Potential Microscopy SERC Science and Engineering Research Council (UK, now replaced - see ESPRC) SESRE Substrate Encoded Size-Reducing Epitaxy SFB. Silicon Fusion Bonding SIA Semiconductor Industry Association SIB Single Batch SiG Silicon Carbide SiCG Silicon Crystal Growth SID Society For Information Display SiE-CVD Silicon Epitaxy by Chemical Vapour Deposition SI-GaA Semi-Insulating Gallium Arsenide SiGe Silicon-Germanium Semiconductor SILAR Successive Ion Layer Adsorption and Reaction SILC Stress Induced Leakage current SILO Strain Induced Lateral-Layer Ordering SIMM Single-in-line Memory Module SIMOX Separation By The Implantation Of Oxygen SIMS Secondary Ion Mass Spectroscopy SILEX Silicon Excellence SiON Silicon Oxynitride SIP Single-in-line Package SSIS Scanning Surface Inspection System SITF SECS Implementation Task Force SLE Sacrificial Layer Etch SLM Spatial Light Modulator SM Stress-Induced Migration SMAC Semiconductor Market Analysis Committee SMD Surface Mount Device SME Small or Medium Sized Enterprise SMEMA Surface Mount Equipment Manufacturers' Association SMIF Standard Mechanical Interface SMM Surface Micro-Machining SPM a new cleaning procedure for CMOS devices. The ratio of chemicals is 1:1 (Sulfuric Acid : Hydrogen Peroxide) at 100 degrees C for 10 /20 minutesSPC Statistical Process Control. SMS SECS Message Services SMT Surface Mount Technology SNMS Sputter Neutral Mass Spectroscopy SOA Safe Operating Area SOC System On a Chip SOD Spin On Dielectric SOG Spin-On-Glass SOI Silicon-On-Insulator SOIC Small Outline Integrated Circuit SOJ Small Outline J-Bend SOP Standard Operating Procedures SOP Small Outline Gull Wing SOP System On a Package SOPHI Silicon Optoelectronic Hybrid Interconnect SOS Silicon-on-Sapphire SPC Single Project Chip SPD Suspended Particle Display SPE Solid Phase Epitaxy SPECS Solution Providers for Embedded Control Systems SPIE Society Of Photo-Optical Instrumentation Engineers SPM Scanning Probe Microscopy SPS Semiconductor Products Section SPUR Support for Projects under Research SPW Single Project Wafer SQL Structured Query Language SQUID Superconducting Quantum Interface Device SRAM Static Random Access Memory SRC Semiconductor Research Corporation SSA Semiconductor Safety Association SSD Solid State Device SSD Solid State Display SSI Small Scale Integration SSKCE Steady State Kilograms Of Carbon Equivalents SSMBE Solid Source Molecular Beam Epitaxy SSMMTCE Steady State Million Metric Tons Of Carbon Equivalents SSPA Solid State Power Amplifier SSR Super Steep Retrograde STE Shallow Trench Etching STEM Scanning Transmission Electron Microscope STFA Surface and Thin Film Analysis SThM Scanning Thermal Microscopy STI Shallow Trench Isolation STM Scanning Tunnelling Microscope STN Super Twisted Nematic (LCD) SWP Silicon Wafer Preparation T. t-DCE Trans-Dichloroethylene TA Trace Analysis TAB Tape Automated Bonding TAD Triple Axis Diffraction TAID Thermal Annealing of Implanted Dopants TAM Total Available Market TAPIA Test, Assembly and Packaging Integrated Architecture TARC Top Anti-Reflective Coating TBD Time to Breakdown TBD Triangular Barrier Diode TBGA Tape Ball Grid Array TBM. Test Block Method TCAD Technology Computer Aided Design TCB Thermal Compression Bonding TCE Thermal Coefficient of Expansion TCP Transformer Coupled Plasma TCP Tape Carrier Package TDBI Test During Burn-In TDDB Time Dependent Dielectric Breakdown TDMAAs Tri-diethyl-aminoarsenic TDEAT Tetrakis-diethylamino-titanium TDMAT Tetrakis-dimethylamino-titanium TED Transient enhanced Diffusion TEGFET Two Dimensional Electron Gas Field Effect Transistor TEM Transmission Electron Microscopy TEOS Tetra-ethoxysilane (Tetraethyl Ortho-silicate) TFD Thin Film Deposition TFEL Thin Film Electro-Luminescence TFI Thin Film Interference TFT Thin Film Transistor TGO Toxic Gas Ordinance TGV Track Guided Vehicle TIA Totally Integrated Automation TiN Titanium Nitride TIPT Tetra-Isopropyltitanate TIS Total Induced Shift TLS Tool Loading System TLV-C. Threshold Limit Value-Ceiling TLV-STEL Threshold Limit Value-Short term Exposure limit TLV-TWA Threshold Limit Value-Time Weighted Average TLV Threshold Limit Value TM Transition Metal TMAH Tetramethyl Ammonium Hydroxide TMDS 1,1,3,3-Tetramethyl-disilazane TMU Total Measurement Uncertainty TN Twisted Nematic TOC Total Organic Carbon TOC Total Oxidisable Carbon TOF-SIMS Time-Of-Flight Secondary Ion Mass Spectrometry TP Throughput TPG Test Position Generator TPM Total Parts Management TQC Total Quality Control TQFP Thin Quad Flat Pack TQM Total Quality Management TRTWC Total room Temperature Wet Cleaning TSCA Toxic Substances Control Act (US) TSI Top Surface Imaging TSIA Taiwan Semiconductor Industry Association TSMC Taiwan Semiconductor Manufacturing TSOP Thin Small Outline Package TSP Total Support Package TTL Through The Lens TTR. Total Time Reduction Program TWA Time Weighted Average TXM Transmission X-Ray Microscope TRXRF Total Reflection X-Ray Fluorescence Spectroscopy U. UCT Ultra Clean Technology UDOF Useable Depth Of Focus UFC Uniform Fire Code UHF Ultra-High Frequency UHP Ultra-High Purity UHV-CVD Ultra-High Vacuum Chemical Vapour Deposition ULEI Ultra-Low Energy Implantation ULPA Ultra-Low Penetration Air Filter ULSI Ultra-Large Scale Integration UPDIW Ultra-Pure Deionised Water UPE Ultra High Molecular Weight Polythene UPS Uninterruptible Power Supply UPW Ultra-Pure Water USD Undoped Silica Glass USDC US Display Consortium USG Undoped Silica Glass USJ Ultra-Shallow Junction UVEPROM Ultra-violet Erasable EPROM V. VASE Variable Angle Ellipsometry VB Vertical Bridgman VC Virtual Component VCE Vapour Cloud Explosion VCO Voltage Controlled Oscillator VCSEL Vertical-Cavity Self-Emitting Laser VCZ Vapour Pressure Czochralski VDMOS Vertically Diffused MOSFET VDSM Very Deep Submicron VFQFP Very Fine Pitch Quad Flatpack VLIW Very Long Instruction Word VPD Vapour Polymerisation Deposition VPE Vapour Phase Epitaxy VPP Voluntary Protection Program VSD Variable Speed Drive VSI Virtual Socket Initiative VSPA Very Small Peripheral Array VUV Vacuum Ultra-Violet W. WDXRF Wavelength Dispersive X-ray Fluorescence WID Wafer Identification WIP Work In Progress WIWNU Within Wafer Non-Uniformity WLBIT Wafer Level Burn-In Test WLR Wafer Level Reliability WLR Wafer Level Reliability WLS Wafer Logistic System WMS Wafer Measurement Systems WSC World Semiconductor Council WSTS World Semiconductor Trade Statistics WTEM Wedge-Shaped Transmission Electron Microscopy WTWNU Wafer-to-Wafer Non-Uniformity X. ANES X-Ray Absorption Near Edge XPM X-Ray Photoelectron Microscopy XPS X-Ray Photoelectron Spectroscopy XRD X-Ray Powder Diffraction XRF X-Ray Fluorescence Analysis XRL. X-Ray Lithography XRR X-Ray Reflectometry XRT X-Ray Topography XTEM Cross-Section Transmission Electron Microscopy Y. YMUX Y-Multiplier Z. ZCCFAA Zeeman-Corrected Graphite Furnace Atomic Absorption ZEBEDEE. Zenithal Bistable Display (DERA, UK) ZIP Zag-Zag in-line Package |
